Heat dissipation substrate, LED package, Power module, Wafer bonding, Power resistor. *Various metalized processing is available (Thin film, Thick film, DBC, AMB, DPC, etc.).
Circuit Substrate, Heatsink, Heat Spreader
Cutting all kinds of graphics, drilling, marking all kinds of aluminum nitride substrate less than 3mm
Aluminum nitride ceramics, high thermal conductivity, high insulation materials, high-end mechanical equipment heat dissipation parts
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silicon nitride ceramic Using silicon nitride cerLearn more >
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