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    3. Home > Products > Aluminum nitride ceramic substrate > Aluminum Nitride ceramic

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      Aluminum Nitride ceramic

      Introduction

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      Product Details
      I. Product Introduction


      Aluminum nitride ceramic substrate:
      It has excellent thermal conductivity, low dielectric constant and dielectric loss, and reliable insulation performance.
      Excellent mechanical properties, non-toxic, high temperature resistance, chemical corrosion resistance;
      Aluminum Nitride Substrate: It has excellent thermal, mechanical and electrical properties, high thermal conductivity, high strength and other excellent characteristics. With the rapid development of microelectronic devices, high thermal conductivity aluminum nitride substrates can be widely applied.
      Aluminum nitride ceramic substrates, which have similar thermal expansion coefficient with silicon, have attracted much attention as new ceramic materials. Aluminum nitride ceramic substrate produced by our company is widely used in communication devices, high brightness LED, power electronic devices and other industries. It is an excellent electronic ceramic material.


      2. Excellent performance
      (1) The thermal conductivity is 5-10 times higher than that of alumina ceramics, which is equivalent to highly toxic beryllium oxide (BeO).
      High thermal conductivity, which is 5 to 10 times of Al2O3
      (2) The thermal expansion coefficient (4.3 *10-6/C) matches the semiconductor silicon material (3.5-4.0 *10-6/C).
      Thermal expansion coefficient matches with hat of silicon
      (3) Good mechanical properties, higher bending strength than BeO ceramics, close to alumina;
      Good mechanical property, which is close to Al2O3 and better than BeO
      (4) Excellent electrical performance, high insulation resistance and low dielectric loss;
      Distinct electrical properties, with very high electrical resistivity and
      Low dielectric loss
      (5) Circuit materials have good compatibility and can be used for multi-layer wiring to achieve high density and miniaturization of packaging.
      Compatible with circuit materials, multilayerwiring can be used to
      Achieve high density and miniaturization of packaging
      (6) Non-toxic, conducive to environmental protection.
      Non-toxic, environment friendly


      III. Application Areas


      (1) Photoelectric Communication Devices
      (2) LED industry
      (3) Functional modules of automotive electronics
      (4) High power supply module
      (5) High Frequency Microwave Applied Devices

      (6) Power and electronic components


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      0.254

      0.381

      0.5

      0.635

      0.8

      1.0

      1.5

      2.0

      2.5

      3.0

      114.3*114.3mm

      120*120mm

      124*124mm

       

      152*152mm

       

       

       

      138*190.5mm

       

       

       

      152*203mm

       

       

       

       

      203*203mm

       

       

       

       

      220*220mm

       

       

       

       

       

      110*290mm

       

       

       

       

      Zhejiang day is a new material technology co., LTD
      TEL : 0577-67000303

      © 2018 Zhejiang day is a new material technology co., LTD All Rights Reserved.

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